Tohru HIZUME

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 8,153,479
- Issue date Apr 10, 2012
- Shinko Electric Industries Co., Ltd.
- Tohru Hizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cost-reducing and process-simplifying wiring board and manufacturin...
- Patent number 6,998,291
- Issue date Feb 14, 2006
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20110045642
- Publication date Feb 24, 2011
- Shinko Electric Industries Co., Ltd.
- Tohru HIZUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cost-reducing and process-simplifying wiring board and manufacturin...
- Publication number 20040266060
- Publication date Dec 30, 2004
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR