Tohru Ishizuka

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,142,449
- Issue date Sep 22, 2015
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon epitaxial wafer, method for manufacturing the same, bonded...
- Patent number 8,823,130
- Issue date Sep 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,697,544
- Issue date Apr 15, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer, semiconductor device, and method for manufacturing SOI w...
- Patent number 8,466,538
- Issue date Jun 18, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 8,338,277
- Issue date Dec 25, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,202,787
- Issue date Jun 19, 2012
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,097,523
- Issue date Jan 17, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring rotation angle of bonded wafer
- Patent number 7,861,421
- Issue date Jan 4, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,799,660
- Issue date Sep 21, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing silicon single crystal and production apparatu...
- Patent number 6,423,285
- Issue date Jul 23, 2002
- Shin-Etsu Handotai Co., Ltd.
- Kirio Itoi
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20150118825
- Publication date Apr 30, 2015
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...
- Publication number 20120326268
- Publication date Dec 27, 2012
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20110223740
- Publication date Sep 15, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110212598
- Publication date Sep 1, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110151643
- Publication date Jun 23, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20110104870
- Publication date May 5, 2011
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
- Publication number 20100323502
- Publication date Dec 23, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...
- Publication number 20100314722
- Publication date Dec 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER
- Publication number 20100132205
- Publication date Jun 3, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI substrate
- Publication number 20080261411
- Publication date Oct 23, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tohru Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS

Tohru Ishizuka

Person

Patents Grantslast 30 patents

Method for manufacturing bonded wafer

Silicon epitaxial wafer, method for manufacturing the same, bonded...

Method for manufacturing bonded wafer

SOI wafer, semiconductor device, and method for manufacturing SOI w...

Method for manufacturing SOI substrate

Method for manufacturing SOI wafer

Method for manufacturing bonded wafer

Method for measuring rotation angle of bonded wafer

Method for manufacturing SOI substrate

Method for producing silicon single crystal and production apparatu...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING BONDED WAFER

SILICON EPITAXIAL WAFER, METHOD FOR MANUFACTURING THE SAME, BONDED...

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI SUBSTRATE

SOI WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SOI W...

METHOD FOR MEASURING ROTATION ANGLE OF BONDED WAFER

Method for manufacturing SOI substrate