Tohru Ohsaka

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and printed wiring board
- Patent number 9,084,364
- Issue date Jul 14, 2015
- Canon Kabushiki Kaisha
- Sou Hoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package
- Patent number 7,851,900
- Issue date Dec 14, 2010
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and printed circuit board
- Patent number 7,839,652
- Issue date Nov 23, 2010
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer print circuit board
- Patent number 7,594,105
- Issue date Sep 22, 2009
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and printed circuit board
- Patent number 7,495,928
- Issue date Feb 24, 2009
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and printed circuit board
- Patent number 7,349,224
- Issue date Mar 25, 2008
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-terminal device and printed wiring board
- Patent number 7,277,298
- Issue date Oct 2, 2007
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered printed wiring board
- Patent number 7,199,308
- Issue date Apr 3, 2007
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered printed wiring board
- Patent number 6,800,814
- Issue date Oct 5, 2004
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board unit for use with electronic apparatus
- Patent number 6,335,866
- Issue date Jan 1, 2002
- Canon Kabushiki Kaisha
- Tohru Ohtaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having an embedded capacitor
- Patent number 5,973,929
- Issue date Oct 26, 1999
- Canon Kabushiki Kaisha
- Tomoyasu Arakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a hole with a laser and an apparatus for forming...
- Patent number 5,302,798
- Issue date Apr 12, 1994
- Canon Kabushiki Kaisha
- Hideo Inagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of introducing liquid into small-diameter hole
- Patent number 5,215,593
- Issue date Jun 1, 1993
- Canon Kabushiki Kaisha
- Shigenobu Nojo
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTED WIRING BOARD
- Publication number 20130343024
- Publication date Dec 26, 2013
- Sou Hoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
- Publication number 20090051015
- Publication date Feb 26, 2009
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
- Publication number 20080128873
- Publication date Jun 5, 2008
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINT CIRCUIT BOARD
- Publication number 20070136618
- Publication date Jun 14, 2007
- Tohru Ohsaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stacked semiconductor package
- Publication number 20060208348
- Publication date Sep 21, 2006
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-terminal device and printed wiring board
- Publication number 20060065965
- Publication date Mar 30, 2006
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and printed circuit board
- Publication number 20050230823
- Publication date Oct 20, 2005
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered printed wiring board
- Publication number 20050039947
- Publication date Feb 24, 2005
- Canon Kabushiki Kaisha
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered printed wiring board
- Publication number 20020108779
- Publication date Aug 15, 2002
- Tohru Ohsaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tohru Ohsaka

Person

Patents Grantslast 30 patents

Printed circuit board and printed wiring board

Stacked semiconductor package

Semiconductor device and printed circuit board

Multilayer print circuit board

Semiconductor device and printed circuit board

Semiconductor device and printed circuit board

Multi-terminal device and printed wiring board

Multi-layered printed wiring board

Multi-layered printed wiring board

Printed wiring board unit for use with electronic apparatus

Printed circuit board having an embedded capacitor

Method of forming a hole with a laser and an apparatus for forming...

Method of introducing liquid into small-diameter hole

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND PRINTED WIRING BOARD

SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

MULTILAYER PRINT CIRCUIT BOARD

Stacked semiconductor package

Multi-terminal device and printed wiring board

Semiconductor device and printed circuit board

Multi-layered printed wiring board

Multi-layered printed wiring board