Tohru Terasaki

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Aiichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring substrate having a castellation structure
- Patent number 8,446,002
- Issue date May 21, 2013
- Sony Corporation
- Noriko Shibuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate having a castellation structure
- Patent number 8,344,501
- Issue date Jan 1, 2013
- Sony Corporation
- Noriko Shibuta
Information Patent Grant
Method of mounting a device to a mounting substrate
- Patent number 6,612,024
- Issue date Sep 2, 2003
- Sony Corporation
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connecting method and apparatus
- Patent number 6,376,050
- Issue date Apr 23, 2002
- Sony Corporation
- Tohru Terasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multilayer wiring substrate, stack structure sensor package, and me...
- Publication number 20100244166
- Publication date Sep 30, 2010
- SONY CORPORATION
- Noriko Shibuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting structure of a semiconductor device, and a process for mou...
- Publication number 20020074163
- Publication date Jun 20, 2002
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS