Tokio Takei

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer and outer-peripheral grinding...
- Patent number 7,727,860
- Issue date Jun 1, 2010
- Shin-Etsu Handotai Co., Ltd.
- Susumu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for silicon wafer and SOI wafer, and SOI wafer
- Patent number 6,583,029
- Issue date Jun 24, 2003
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a bonding substrate
- Patent number 6,110,391
- Issue date Aug 29, 2000
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holding jig
- Patent number 5,938,512
- Issue date Aug 17, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- B24 - GRINDING POLISHING
Information Patent Grant
Bonded wafer and method of manufacturing it
- Patent number 5,340,435
- Issue date Aug 23, 1994
- Yatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a substrate for forming semiconductor devices...
- Patent number 5,071,785
- Issue date Dec 10, 1991
- Shin-Etsu Handotai Co., Ltd.
- Yasuaki Nakazato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grindi...
- Publication number 20090233109
- Publication date Sep 17, 2009
- SHIN-ETSU HANDOTAI CO., LDT.
- Keiichi Okabe
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing bonded wafer and outer-peripheral grinding...
- Publication number 20090042363
- Publication date Feb 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Susumu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Wafer and Bonded Wafer
- Publication number 20080315349
- Publication date Dec 25, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for silicon wafer and soi wafer, and soi wafer
- Publication number 20030008478
- Publication date Jan 9, 2003
- Takao Abe
- B24 - GRINDING POLISHING