Tokiyuki Seto

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Odawara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic bonding apparatus and quality monitoring method
- Patent number 5,431,324
- Issue date Jul 11, 1995
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and testing apparatus of a bonded portion
- Patent number 5,323,952
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Mituo Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film magnetic head having Au ultrasonic connection structure
- Patent number 4,796,132
- Issue date Jan 3, 1989
- Hitachi, Ltd.
- Yoshinori Dekura
- G11 - INFORMATION STORAGE