TREA

Tokuro Yamaki

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder connection structure and solder ball
    • Patent number 8,975,757
    • Issue date Mar 10, 2015
    • Senju Metal Industry Co., Ltd.
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 8,691,143
    • Issue date Apr 8, 2014
    • Senju Metal Industry Co., Ltd.
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL
    • Publication number 20110115084
    • Publication date May 19, 2011
    • Minoru Ueshima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20090232696
    • Publication date Sep 17, 2009
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-Free Solder
    • Publication number 20070243098
    • Publication date Oct 18, 2007
    • Tsukasa Ohnishi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR