Tom George

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,756,826
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive structures, and relate...
- Patent number 11,527,546
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 11,177,279
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures, assemblies having vertically-stacked memory...
- Patent number 11,177,276
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Nancy M. Lomeli
- G11 - INFORMATION STORAGE
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,121,146
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 10,658,380
- Issue date May 19, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and assemblies having vertically-stacked memo...
- Patent number 10,424,596
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Nancy M. Lomeli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230343393
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES
- Publication number 20220415917
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures, Assemblies Having Vertically-Stacked Memory...
- Publication number 20220037358
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Nancy M. Lomeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...
- Publication number 20220037350
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20210408029
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Barrier Material Between Silicon-Conta...
- Publication number 20210091009
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Devesh Kumar Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200279867
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20200119036
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200119040
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures, Assemblies Having Vertically-Stacked Memory...
- Publication number 20200075620
- Publication date Mar 5, 2020
- Micron Technology, Inc.
- Nancy M. Lomeli
- G11 - INFORMATION STORAGE
Information Patent Application
Conductive Structures, Assemblies Having Vertically-Stacked Memory...
- Publication number 20190198518
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Nancy M. Lomeli
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Forming terminations in stacked memory arrays

Microelectronic devices including conductive structures, and relate...

Formation of termination structures in stacked memory arrays

Conductive structures, assemblies having vertically-stacked memory...

Forming terminations in stacked memory arrays

Formation of termination structures in stacked memory arrays

Conductive structures and assemblies having vertically-stacked memo...

Patents Applicationslast 30 patents

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES

Conductive Structures, Assemblies Having Vertically-Stacked Memory...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE STRUCTURES, AND RELATE...

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

Integrated Assemblies Having Barrier Material Between Silicon-Conta...

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

Conductive Structures, Assemblies Having Vertically-Stacked Memory...

Conductive Structures, Assemblies Having Vertically-Stacked Memory...