Tom Kampschreur

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Arnhem, NL

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Patents Grantslast 30 patents

Information Patent Grant
Device, apparatus and system
- Patent number 10,998,804
- Issue date May 4, 2021
- NEXPERIA, B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an electronic product with flexible substrate
- Patent number 10,104,784
- Issue date Oct 16, 2018
- NXP B.V.
- Jozep Petrus Wilhelmus Stokkermans
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
System and method for processing a flexible substrate
- Patent number 9,994,407
- Issue date Jun 12, 2018
- NXP B.V.
- Jozef P. W. Stokkermans
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wirebonding method and apparatus
- Patent number 8,474,680
- Issue date Jul 2, 2013
- Invensas Corporation
- Thomas M. Kampschreur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer method and apparatus
- Patent number 7,726,011
- Issue date Jun 1, 2010
- NXP B.V.
- Johannes Wilhelmus Dorotheus Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebonding method and apparatus
- Patent number 7,578,425
- Issue date Aug 25, 2009
- NXP B.V.
- Thomas Markus Kampschreur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE, APPARATUS AND SYSTEM
- Publication number 20200195111
- Publication date Jun 18, 2020
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PROCESSING A FLEXIBLE SUBSTRATE
- Publication number 20170129731
- Publication date May 11, 2017
- NXP B.V.
- Jozef P. W. Stokkermans
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PRODUCT WITH FLEXIBLE SUBSTRATE
- Publication number 20170135224
- Publication date May 11, 2017
- NXP B.V.
- JOZEP PETRUS WILHELM STOKKERMANS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIREBONDING METHOD AND APPARATUS
- Publication number 20090277950
- Publication date Nov 12, 2009
- NXP B.V.
- THOMAS Markus KAMPSCHREUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip transfer method and apparatus
- Publication number 20070137031
- Publication date Jun 21, 2007
- Johannes Wilhelmus Dorotheus Bosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wirebonding method and apparatus
- Publication number 20060016860
- Publication date Jan 26, 2006
- Koninklijke Philips Electronics N.V.
- Thomas Kampschreur
- H01 - BASIC ELECTRIC ELEMENTS