Tom Lii

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric liner added after contact etch before silicide formation
- Patent number 10,134,731
- Issue date Nov 20, 2018
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer shaper formation with conformal dielectric film for void fre...
- Patent number 9,741,624
- Issue date Aug 22, 2017
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform, damage free nitride ETCH
- Patent number 9,704,720
- Issue date Jul 11, 2017
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liner added after contact etch before silicide formation
- Patent number 9,659,935
- Issue date May 23, 2017
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform, damage free nitride etch
- Patent number 9,437,449
- Issue date Sep 6, 2016
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer shaper formation with conformal dielectric film for void fre...
- Patent number 9,406,779
- Issue date Aug 2, 2016
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate process
- Patent number 9,385,044
- Issue date Jul 5, 2016
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask for source/drain epitaxy control
- Patent number 9,224,657
- Issue date Dec 29, 2015
- Texas Instruments Incorporated
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric liner added after contact etch before silicide formation
- Patent number 9,093,380
- Issue date Jul 28, 2015
- Texas Instruments Incorporated
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer shaper formation with conformal dielectric film for void fre...
- Patent number 9,093,303
- Issue date Jul 28, 2015
- Texas Instruments Incorported
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal contact opening with a width that is smal...
- Patent number 9,054,158
- Issue date Jun 9, 2015
- Texas Instruments Incorporated
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral uniformity in silicon recess etch
- Patent number 8,507,386
- Issue date Aug 13, 2013
- Texas Instruments Incorporated
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION
- Publication number 20170221895
- Publication date Aug 3, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM, DAMAGE FREE NITRIDE ETCH
- Publication number 20160343581
- Publication date Nov 24, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...
- Publication number 20160307808
- Publication date Oct 20, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION
- Publication number 20150287723
- Publication date Oct 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...
- Publication number 20150287804
- Publication date Oct 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LAYER HARDMASK FOR EMBEDDED EPI GROWTH
- Publication number 20150187661
- Publication date Jul 2, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MASK FOR SOURCE/DRAIN EPITAXY CONTROL
- Publication number 20150044830
- Publication date Feb 12, 2015
- TEXAS INSTRUMENTS INCORPORATED
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION
- Publication number 20140361376
- Publication date Dec 11, 2014
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Metal Contact Opening with a Width that is Smal...
- Publication number 20140227877
- Publication date Aug 14, 2014
- TEXAS INSTRUMENTS INCORPORATED
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM, DAMAGE FREE NITRIDE ETCH
- Publication number 20140187009
- Publication date Jul 3, 2014
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE PROCESS
- Publication number 20140187010
- Publication date Jul 3, 2014
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...
- Publication number 20140021556
- Publication date Jan 23, 2014
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH LITHOGRAPHY PROCESS
- Publication number 20120100717
- Publication date Apr 26, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Tom Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral Uniformity in Silicon Recess Etch
- Publication number 20120064686
- Publication date Mar 15, 2012
- TEXAS INSTRUMENTS INCORPORATED
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Dielectric liner added after contact etch before silicide formation

Spacer shaper formation with conformal dielectric film for void fre...

Uniform, damage free nitride ETCH

Dielectric liner added after contact etch before silicide formation

Uniform, damage free nitride etch

Spacer shaper formation with conformal dielectric film for void fre...

Replacement gate process

Hard mask for source/drain epitaxy control

Dielectric liner added after contact etch before silicide formation

Spacer shaper formation with conformal dielectric film for void fre...

Method of forming a metal contact opening with a width that is smal...

Lateral uniformity in silicon recess etch

Patents Applicationslast 30 patents

DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION

UNIFORM, DAMAGE FREE NITRIDE ETCH

SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...

DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION

SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...

DUAL LAYER HARDMASK FOR EMBEDDED EPI GROWTH

HARD MASK FOR SOURCE/DRAIN EPITAXY CONTROL

DIELECTRIC LINER ADDED AFTER CONTACT ETCH BEFORE SILICIDE FORMATION

Method of Forming a Metal Contact Opening with a Width that is Smal...

UNIFORM, DAMAGE FREE NITRIDE ETCH

REPLACEMENT GATE PROCESS

SPACER SHAPER FORMATION WITH CONFORMAL DIELECTRIC FILM FOR VOID FRE...

TRENCH LITHOGRAPHY PROCESS

Lateral Uniformity in Silicon Recess Etch