Tom Torfs

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Plurality of devices attached by solder bumps
- Patent number 7,687,904
- Issue date Mar 30, 2010
- IMEC
- Walter De Raedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of bonding two semiconductor devices
- Patent number 7,205,177
- Issue date Apr 17, 2007
- Interuniversitair Microelektronica Centrum (IMEC)
- Walter De Raedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR BONDING AND DEVICES ACCORDING TO SUCH METHODS
- Publication number 20070182012
- Publication date Aug 9, 2007
- Interuniversitair Microelektronica Centrum (IMEC)
- Walter DeRaedt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for bonding and devices according to such methods
- Publication number 20060012037
- Publication date Jan 19, 2006
- Walter De Raedt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...