Tomas Bergsten

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Rangedala, SE

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Patents Grantslast 30 patents

Information Patent Grant
PCB structure and method and apparatus for forming the PCB structure
- Patent number 11,477,878
- Issue date Oct 18, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Peng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,201,098
- Issue date Feb 5, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing a signal transition component having a C-sh...
- Patent number 10,193,206
- Issue date Jan 29, 2019
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ligander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective partitioning of via structures in printed circuit boards
- Patent number 10,034,391
- Issue date Jul 24, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig Kallman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component for reducing mechanical stress on a PCB
- Patent number 8,553,428
- Issue date Oct 8, 2013
- Telefonaktiebolaget L M Ericsson (Publ)
- Lars Bolander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PCB Structure and Method and Apparatus for Forming the PCB Structure
- Publication number 20210274638
- Publication date Sep 2, 2021
- Peng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS
- Publication number 20180310418
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Stig KALLMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A Signal Transition Component
- Publication number 20170273172
- Publication date Sep 21, 2017
- Telefonaktiebolaget LM Ericsson (publ)
- Per Ligander
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE PARTITIONING OF VIA STRUCTURES IN PRINTED CIRCUIT BOARDS
- Publication number 20160021762
- Publication date Jan 21, 2016
- TELEFONAKTIEBOLAGET L M ERICSSON (publ)
- Stig Kallman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component For Reducing Mechanical Stress On A PCB
- Publication number 20100182759
- Publication date Jul 22, 2010
- Lars Bolander
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...