Tomasz Naeve

Person

Finkenstein, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Multiphase inverter apparatus having half-bridge circuits and a pha...
- Patent number 11,979,096
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with clip and connector above electronic components
- Patent number 11,756,859
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an extension element for air cooling
- Patent number 11,646,252
- Issue date May 9, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistor packages with exposed source and drain cont...
- Patent number 11,600,558
- Issue date Mar 7, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 11,502,012
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiphase inverter apparatus
- Patent number 11,303,222
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...
- Publication number 20230187326
- Publication date Jun 15, 2023
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electrically Insulating Core with E...
- Publication number 20230077139
- Publication date Mar 9, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Low Parasitic Connection to Passive Device
- Publication number 20230017391
- Publication date Jan 19, 2023
- INFINEON TECHNOLOGIES AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH CASTELLATED BOARD
- Publication number 20220377901
- Publication date Nov 24, 2022
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...
- Publication number 20220224247
- Publication date Jul 14, 2022
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE WITH CLIP AND CONNECTOR ABOVE ELECTRONIC COMPONENTS
- Publication number 20210305126
- Publication date Sep 30, 2021
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including an Extension Element for Air Cooling
- Publication number 20210242114
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210233823
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiphase Inverter Apparatus
- Publication number 20210104957
- Publication date Apr 8, 2021
- Tomasz Naeve
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip Package, Method of Forming a Chip Package, Semiconductor Devic...
- Publication number 20200328141
- Publication date Oct 15, 2020
- INFINEON TECHNOLOGIES AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS

Tomasz Naeve

Person

Patents Grantslast 30 patents

Multiphase inverter apparatus having half-bridge circuits and a pha...

Semiconductor package with low parasitic connection to passive device

Semiconductor device having a carrier, semiconductor chip packages...

Package with clip and connector above electronic components

Semiconductor device including an extension element for air cooling

Plurality of transistor packages with exposed source and drain cont...

Semiconductor packages and methods of manufacturing thereof

Multiphase inverter apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES...

Semiconductor Package Having an Electrically Insulating Core with E...

Semiconductor Package with Low Parasitic Connection to Passive Device

ELECTRONIC DEVICE WITH CASTELLATED BOARD

MULTIPHASE INVERTER APPARATUS HAVING HALF-BRIDGE CIRCUITS AND A PHA...

PACKAGE WITH CLIP AND CONNECTOR ABOVE ELECTRONIC COMPONENTS

Semiconductor Device Including an Extension Element for Air Cooling

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Multiphase Inverter Apparatus

Chip Package, Method of Forming a Chip Package, Semiconductor Devic...