Tomi Pekka Bernhard Nissinen

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Thermally-conductive, low strength backfill material
- Patent number 11,078,117
- Issue date Aug 3, 2021
- Nano and Advanced Materials Institute Limited
- Tomi Pekka Bernhard Nissinen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Foam formulation and method of preparing solid porous materials wit...
- Patent number 10,442,734
- Issue date Oct 15, 2019
- Nano and Advanced Materials Institute Limited
- Guoxing Sun
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY-CONDUCTIVE, LOW STRENGTH BACKFILL MATERIAL
- Publication number 20200377415
- Publication date Dec 3, 2020
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Tomi Pekka Bernhard NISSINEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FOAM FORMULATION AND METHOD OF PREPARING SOLID POROUS MATERIALS WIT...
- Publication number 20170321026
- Publication date Nov 9, 2017
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Guoxing Sun
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES