Tomihiro Hara

Person

Kanagawa pref, JP

People

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CONNECTING METHOD AND ELECTRICALLY CONNECTED CONNECTION...
- Publication number 20110139500
- Publication date Jun 16, 2011
- Tomihiro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
- Publication number 20110000700
- Publication date Jan 6, 2011
- Yoshiaki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTIC...
- Publication number 20090321015
- Publication date Dec 31, 2009
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Film adhesive for sealing, film laminate for sealing and sealing me...
- Publication number 20040213973
- Publication date Oct 28, 2004
- Tomihiro Hara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting adhesive film, and an adhesive structure based on the...
- Publication number 20040068061
- Publication date Apr 8, 2004
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting adhesive
- Publication number 20040063804
- Publication date Apr 1, 2004
- Masaaki Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Tomihiro Hara

Person

Patents Applicationslast 30 patents

ELECTRICAL CONNECTING METHOD AND ELECTRICALLY CONNECTED CONNECTION...

METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE

ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTIC...

Film adhesive for sealing, film laminate for sealing and sealing me...

Thermosetting adhesive film, and an adhesive structure based on the...

Thermosetting adhesive