Tomiho Yamada

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Aichi-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Prepreg and conductive layer-laminated substrate for printed wiring...
- Patent number 7,820,274
- Issue date Oct 26, 2010
- NOF Corporation
- Toshihiro Ohta
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composite dielectric material composition, and film, substrate, ele...
- Patent number 6,420,476
- Issue date Jul 16, 2002
- TDK Corporation
- Toshiaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PREPREG AND CONDUCTIVE LAYER-LAMINATED SUBSTRATE FOR PRINTED WIRING...
- Publication number 20070281566
- Publication date Dec 6, 2007
- NOF Corporation
- Toshihiro Ohta
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR PRINTED WIRING BOARD FILM AND USE THEREOF
- Publication number 20070281142
- Publication date Dec 6, 2007
- NOF Corporation
- Toshihiro Ohta
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...