Tomiichi Sudou

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Nishishirakawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing workpiece by using wire saw and wire saw
- Patent number 8,037,878
- Issue date Oct 18, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW
- Publication number 20100252017
- Publication date Oct 7, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE