Tomio Kashihara

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus
- Patent number 4,571,688
- Issue date Feb 18, 1986
- Tokyo Shibaura Denki Kabushiki Kaisha
- Tomio Kashihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for conveying a lead frame mounting semiconductor pellets
- Patent number 4,516,673
- Issue date May 14, 1985
- Tokyo Shibaura Denki Kabushiki Kaisha
- Tomio Kashihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for automatically controlling the position of small objects
- Patent number 4,203,064
- Issue date May 13, 1980
- Tokyo Shibaura Electric Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS