Tomio Kudo

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive film forming method and sintering promoter
- Patent number 9,905,339
- Issue date Feb 27, 2018
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper particulate dispersion, conductive film forming method and c...
- Patent number 9,615,455
- Issue date Apr 4, 2017
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper particulate dispersion, conductive film forming method and c...
- Patent number 9,120,944
- Issue date Sep 1, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160029483
- Publication date Jan 28, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160007455
- Publication date Jan 7, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER
- Publication number 20150118413
- Publication date Apr 30, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER
- Publication number 20150030784
- Publication date Jan 29, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...
- Publication number 20150021071
- Publication date Jan 22, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...
- Publication number 20140370310
- Publication date Dec 18, 2014
- Applied Nanotech Holdings, Inc.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...
- Publication number 20140216799
- Publication date Aug 7, 2014
- APPLIED NANOTECH HOLDINGS, INC.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...
- Publication number 20140216798
- Publication date Aug 7, 2014
- APPLIED NANOTECH HOLDINGS, INC.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Conductive film forming method and sintering promoter

Copper particulate dispersion, conductive film forming method and c...

Copper particulate dispersion, conductive film forming method and c...

Patents Applicationslast 30 patents

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER

CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER

CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...

CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...