Tomio Yamada

Person

Tamamura-machi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid integrated circuit device and electronic device
- Patent number 8,581,395
- Issue date Nov 12, 2013
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device and electronic device
- Patent number 8,222,734
- Issue date Jul 17, 2012
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 8,084,852
- Issue date Dec 27, 2011
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,902,656
- Issue date Mar 8, 2011
- Renesas Electronics Corporation
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,755,182
- Issue date Jul 13, 2010
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,518,228
- Issue date Apr 14, 2009
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,468,294
- Issue date Dec 23, 2008
- Hitachi, Ltd.
- Masashi Yamaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid integrated circuit device, and method for fabricating the sa...
- Patent number 7,323,770
- Issue date Jan 29, 2008
- Renesas Technology Corp.
- Shinji Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 7,223,636
- Issue date May 29, 2007
- Renesas Technology Corp.
- Yoshihiko Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing the same
- Patent number 7,023,706
- Issue date Apr 4, 2006
- Renesas Technology Corp.
- Mikio Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing the same
- Patent number 6,989,587
- Issue date Jan 24, 2006
- Renesas Technology Corp.
- Mamoru Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an elastic resin with a low modulus of...
- Patent number 6,831,360
- Issue date Dec 14, 2004
- Renesas Technology Corp.
- Masashi Yamaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices
- Patent number 6,710,263
- Issue date Mar 23, 2004
- Renesas Technology Corporation
- Toshiyuki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit devices for high-speed or high fre...
- Patent number 5,677,570
- Issue date Oct 14, 1997
- Hitachi, Ltd.
- Hiroshi Kondoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same, as well as lea...
- Patent number 5,382,546
- Issue date Jan 17, 1995
- Hitachi, Ltd.
- Tomio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, its fabrication method and molding apparatus...
- Patent number 5,200,366
- Issue date Apr 6, 1993
- Hitachi, Ltd.
- Tomio Yamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20120248630
- Publication date Oct 4, 2012
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20120106110
- Publication date May 3, 2012
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20110121365
- Publication date May 26, 2011
- RENESAS ELECTRONICS CORPORATION
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20100207275
- Publication date Aug 19, 2010
- Renesas Technology Corp.
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...
- Publication number 20090174060
- Publication date Jul 9, 2009
- Renesas Technology Corp.
- Shinji MORIYAMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Hybrid integrated circuit device, and method for fabricating the sa...
- Publication number 20070252264
- Publication date Nov 1, 2007
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Manufacturing method of semiconductor device and semiconductor device
- Publication number 20070105283
- Publication date May 10, 2007
- RENESAS TECHNOLOGY CORP.
- Yoshihiko Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid integrated circuit device, and method for fabricating the sa...
- Publication number 20060091526
- Publication date May 4, 2006
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Manufacturing method of semiconductor device and semiconductor device
- Publication number 20050101052
- Publication date May 12, 2005
- Yoshihiko Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050082683
- Publication date Apr 21, 2005
- RENESAS TECHNOLOGY CORP.
- Masashi Yamaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing the same
- Publication number 20040113248
- Publication date Jun 17, 2004
- Mamoru Ito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Hybrid integrated circuit device and method for fabricating the sam...
- Publication number 20040080044
- Publication date Apr 29, 2004
- Shinji Moriyama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor device and manufacturing the same
- Publication number 20030165052
- Publication date Sep 4, 2003
- Mikio Negishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20020089052
- Publication date Jul 11, 2002
- Masashi Yamaura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices
- Publication number 20010023983
- Publication date Sep 27, 2001
- Toshiyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Tomio Yamada

Person

Patents Grantslast 30 patents

Hybrid integrated circuit device and electronic device

Hybrid integrated circuit device and electronic device

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device, and method for fabricating the sa...

Hybrid integrated circuit device, and method for fabricating the sa...

Semiconductor device and a method of manufacturing the same

Hybrid integrated circuit device, and method for fabricating the sa...

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device and manufacturing the same

Semiconductor device and manufacturing the same

Semiconductor device having an elastic resin with a low modulus of...

Semiconductor devices

Semiconductor integrated circuit devices for high-speed or high fre...

Semiconductor device and method of fabricating same, as well as lea...

Semiconductor device, its fabrication method and molding apparatus...

Patents Applicationslast 30 patents

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SA...

Hybrid integrated circuit device, and method for fabricating the sa...

Manufacturing method of semiconductor device and semiconductor device

Hybrid integrated circuit device, and method for fabricating the sa...

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing the same

Hybrid integrated circuit device and method for fabricating the sam...

Semiconductor device and manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor devices