Tommy Howard Ricketson

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Plumsteadville, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Head assembly for chip mounter
- Patent number 7,493,689
- Issue date Feb 24, 2009
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder and tape feeding and recovering modules therefor
- Patent number 7,380,581
- Issue date Jun 3, 2008
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Head assembly for a component mounter
- Patent number 7,302,755
- Issue date Dec 4, 2007
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder for component mounter and method of automatically setti...
- Patent number 7,243,828
- Issue date Jul 17, 2007
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Head assembly for chip mounter
- Publication number 20070119143
- Publication date May 31, 2007
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Head assembly for a component mounter
- Publication number 20060196046
- Publication date Sep 7, 2006
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape feeder and tape feeding and recovering modules therefor
- Publication number 20060162868
- Publication date Jul 27, 2006
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tape feeder for component mounter and method of automatically setti...
- Publication number 20060102681
- Publication date May 18, 2006
- Samsung Techwin Co., Ltd.
- Tommy Howard Ricketson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR