Tommy Pan

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package process and package structure
- Patent number 11,222,866
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 9,698,120
- Issue date Jul 4, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 8,618,645
- Issue date Dec 31, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and package process
- Patent number 8,446,000
- Issue date May 21, 2013
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and carrier thereof
- Patent number 7,791,211
- Issue date Sep 7, 2010
- Advanced Semiconductor Engineering, Inc.
- Jen-Chuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20220157775
- Publication date May 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20170278823
- Publication date Sep 28, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20140087519
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE PROCESS
- Publication number 20110121442
- Publication date May 26, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20110074004
- Publication date Mar 31, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
- Publication number 20100327465
- Publication date Dec 30, 2010
- Advanced Semiconductor Engineering, Inc.
- CHI-CHIH SHEN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PRO...
- Publication number 20090127706
- Publication date May 21, 2009
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package structure and carrier thereof
- Publication number 20090102047
- Publication date Apr 23, 2009
- Advanced Semiconductor Engineering, Inc.
- Jen-Chuan Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Person

Patents Grantslast 30 patents

Package process and package structure

Package process and package structure

Package process and package structure

Package structure and package process

Flip chip package structure and carrier thereof

Patents Applicationslast 30 patents

PACKAGE PROCESS AND PACKAGE STRUCTURE

PACKAGE PROCESS AND PACKAGE STRUCTURE

PACKAGE PROCESS AND PACKAGE STRUCTURE

PACKAGE STRUCTURE AND PACKAGE PROCESS

PACKAGE PROCESS AND PACKAGE STRUCTURE

PACKAGE PROCESS AND PACKAGE STRUCTURE

CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PRO...

Flip chip package structure and carrier thereof