Tomoaki Hashimoto

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Hyogo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing stacked semiconductor device
- Patent number 6,852,571
- Issue date Feb 8, 2005
- Renesas Technology Corp.
- Tetsuya Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array semiconductor device
- Patent number 6,590,286
- Issue date Jul 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Makio Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing stacked semiconductor device
- Publication number 20040180471
- Publication date Sep 16, 2004
- RENESAS TECHNOLOGY CORP.
- Tetsuya Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array semiconductor device and method of mounting land gr...
- Publication number 20020153608
- Publication date Oct 24, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Makio Okada
- H01 - BASIC ELECTRIC ELEMENTS