Tomoaki KATO

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Chiyoda-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structure, method of manufacturing same, electric motor, and...
- Patent number 11,059,133
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element bonding body, semiconductor device, and metho...
- Patent number 11,011,440
- Issue date May 18, 2021
- Mitsubishi Electric Corporation
- Koji Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 10,468,375
- Issue date Nov 5, 2019
- Mitsubishi Electric Corporation
- Koji Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT BONDING BODY, SEMICONDUCTOR DEVICE, AND METHO...
- Publication number 20200273762
- Publication date Aug 27, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE, METHOD OF MANUFACTURING SAME, ELECTRIC MOTOR, AND...
- Publication number 20200262010
- Publication date Aug 20, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190221540
- Publication date Jul 18, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS