Tomoaki Koide

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a copper thin film
- Patent number 6,887,522
- Issue date May 3, 2005
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the formation of copper wiring films
- Patent number 6,562,219
- Issue date May 13, 2003
- Anelva Corporation
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning metallic films built up within thin film deposit...
- Patent number 5,993,679
- Issue date Nov 30, 1999
- Anelva Corporation
- Tomoaki Koide
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface processing apparatus
- Patent number 5,961,776
- Issue date Oct 5, 1999
- Anelva Corporation
- Hisaaki Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming a copper thin film
- Publication number 20020157610
- Publication date Oct 31, 2002
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for the formation of copper wiring films
- Publication number 20020134686
- Publication date Sep 26, 2002
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CVD apparatus and CVD method for copper deposition
- Publication number 20010006701
- Publication date Jul 5, 2001
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...