Tomoaki Nishino

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Soldering material
- Patent number 10,888,957
- Issue date Jan 12, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT
- Publication number 20200061757
- Publication date Feb 27, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki NISHINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Soldering Material, Solder Joint, and Method for Inspecting Solderi...
- Publication number 20180281118
- Publication date Oct 4, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Core Material, Semiconductor Package, and Forming Method of Bump El...
- Publication number 20180174991
- Publication date Jun 21, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki Nishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...