Tomofumi Nakamura

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having chip-on-chip structure, and semiconduct...
- Patent number 6,635,969
- Issue date Oct 21, 2003
- Rohm Co., Ltd.
- Tomofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip or device having a connecting member formed on a...
- Patent number 6,355,977
- Issue date Mar 12, 2002
- Rohm, Co., Ltd.
- Tomofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming SOI structure
- Patent number 5,948,162
- Issue date Sep 7, 1999
- Rohm Co., Ltd.
- Tomofumi Nakamura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for forming SOI structure
- Patent number 5,417,180
- Issue date May 23, 1995
- Rohm Co., Ltd.
- Tomofumi Nakamura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer jig
- Patent number 5,219,079
- Issue date Jun 15, 1993
- Rohm Co., Ltd.
- Tomofumi Nakamura
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Method for producing SOI substrate
- Patent number 5,208,167
- Issue date May 4, 1993
- Rohm Co., Ltd.
- Tomofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS