Membership
Tour
Register
Log in
Tomoharu NAKAYAMA
Follow
Person
Osaka, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Copper plating solution and copper plating method
Patent number
10,450,666
Issue date
Oct 22, 2019
C. Uyemura & Co., Ltd.
Yuko Yoshioka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
ELECTROLESS COPPER PLATING BATH
Publication number
20210262096
Publication date
Aug 26, 2021
C. UYEMURA & CO., LTD
Hideaki TAKADA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
COPPER PLATING SOLUTION AND COPPER PLATING METHOD
Publication number
20200002830
Publication date
Jan 2, 2020
C. Uyemura & Co., Ltd.
YUKO YOSHIOKA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
COPPER PLATING SOLUTION AND COPPER PLATING METHOD
Publication number
20170268119
Publication date
Sep 21, 2017
C. Uyemura & Co., Ltd.
YUKO YOSHIOKA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD
Publication number
20130295294
Publication date
Nov 7, 2013
C. Uyemura & Co., Ltd.
Takahiro ISHIZAKI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...