Tomohiro Iwano

Person

Hitachi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Slurry, screening method, and polishing method
- Patent number 12,104,112
- Issue date Oct 1, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,814,548
- Issue date Nov 14, 2023
- Resonac Corporation
- Tomohiro Iwano
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,773,291
- Issue date Oct 3, 2023
- Resonac Corporation
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,767,448
- Issue date Sep 26, 2023
- Resonac Corporation
- Takaaki Matsumoto
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry and polishing method
- Patent number 11,702,569
- Issue date Jul 18, 2023
- Resonac Corporation
- Takaaki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing solution and polishing method
- Patent number 11,655,394
- Issue date May 23, 2023
- Resonac Corporation
- Yuya Otsuka
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, polishing-liquid set, polishing liquid, and polishing metho...
- Patent number 11,578,236
- Issue date Feb 14, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,572,490
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry and polishing method
- Patent number 11,566,150
- Issue date Jan 31, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Slurry, and polishing method
- Patent number 11,518,920
- Issue date Dec 6, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoyasu Hasegawa
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Slurry and polishing method
- Patent number 11,505,731
- Issue date Nov 22, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takaaki Matsumoto
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, polishing solution production method, and polishing method
- Patent number 11,499,078
- Issue date Nov 15, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomomi Kukita
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, method for producing polishing liquid, and polishing method
- Patent number 11,492,526
- Issue date Nov 8, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomoyasu Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry, polishing solution production method, and polishing method
- Patent number 11,359,121
- Issue date Jun 14, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomomi Kukita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing liquid, polishing liquid set and polishing method
- Patent number 11,352,523
- Issue date Jun 7, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing liquid, polishing liquid set and polishing method
- Patent number 11,292,939
- Issue date Apr 5, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing liquid, polishing liquid set, and polishing method
- Patent number 11,198,796
- Issue date Dec 14, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing liquid, polishing liquid set, and substrate polishing method
- Patent number 11,046,869
- Issue date Jun 29, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing agent, stock solution for polishing agent, and polishing...
- Patent number 10,946,494
- Issue date Mar 16, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Masayuki Hanano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing liquid set, polishing liquid, method for polishin...
- Patent number 10,825,687
- Issue date Nov 3, 2020
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Abrasive, abrasive set, and method for polishing substrate
- Patent number 10,759,968
- Issue date Sep 1, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry, polishing-liquid set, polishing liquid, method for polishin...
- Patent number 10,752,807
- Issue date Aug 25, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry, polishing fluid set, polishing fluid, and substrate polishi...
- Patent number 10,703,947
- Issue date Jul 7, 2020
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent, polishing agent set, and substrate polishing method
- Patent number 10,557,058
- Issue date Feb 11, 2020
- Hitachi Chemical Company, Ltd.
- Toshiaki Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 10,557,059
- Issue date Feb 11, 2020
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Slurry, polishing-solution set, polishing solution, substrate polis...
- Patent number 10,549,399
- Issue date Feb 4, 2020
- HITACHI CHEMCIAL COMPANY, LTD.
- Tomohiro Iwano
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive, abrasive set, and method for abrading substrate
- Patent number 10,196,542
- Issue date Feb 5, 2019
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing liquid for CMP, and polishing method
- Patent number 10,155,886
- Issue date Dec 18, 2018
- Hitachi Chemical Company, Ltd.
- Munehiro Oota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Slurry, polishing solution set, polishing solution, and substrate p...
- Patent number 10,131,819
- Issue date Nov 20, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20240425737
- Publication date Dec 26, 2024
- Resonac Corporation
- Satoyuki NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHIN...
- Publication number 20240336810
- Publication date Oct 10, 2024
- Resonac Corporation
- Yasushi KURATA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHI...
- Publication number 20240336809
- Publication date Oct 10, 2024
- Resonac Corporation
- Yasushi KURATA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTO...
- Publication number 20230392043
- Publication date Dec 7, 2023
- Shigeki KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR CO...
- Publication number 20230357600
- Publication date Nov 9, 2023
- Satoshi FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
- Publication number 20230203342
- Publication date Jun 29, 2023
- Tomomi KUKITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20220033680
- Publication date Feb 3, 2022
- Showa Denko Materials Co., Ltd.
- Tomohiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
- Publication number 20220017783
- Publication date Jan 20, 2022
- Showa Denko Materials Co., Ltd.
- Tomohiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, AND POLISHING METHOD
- Publication number 20210324237
- Publication date Oct 21, 2021
- Showa Denko Materials Co., Ltd.
- Tomoyasu HASEGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20210309884
- Publication date Oct 7, 2021
- Showa Denko Materials Co., Ltd.
- Satoyuki NOMURA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20210301179
- Publication date Sep 30, 2021
- Showa Denko Materials Co., Ltd.
- Satoyuki NOMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20210261821
- Publication date Aug 26, 2021
- Showa Denko Materials Co., Ltd.
- Takaaki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, POLISHING SOLUTION PRODUCTION METHOD, AND POLISHING METHOD
- Publication number 20210261820
- Publication date Aug 26, 2021
- Showa Denko Materials Co., Ltd.
- Tomomi KUKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, METHOD FOR PRODUCING POLISHING LIQUID, AND POLISHING METHOD
- Publication number 20210246346
- Publication date Aug 12, 2021
- Showa Denko Materials Co., Ltd.
- Tomoyasu HASEGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20210207002
- Publication date Jul 8, 2021
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, SLURRY SET AND POLISHING METHOD
- Publication number 20210071037
- Publication date Mar 11, 2021
- Tomohiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
- Publication number 20210054233
- Publication date Feb 25, 2021
- Hitachi Chemical Company, Ltd.
- Takaaki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
- Publication number 20210017422
- Publication date Jan 21, 2021
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SOLUTION AND POLISHING METHOD
- Publication number 20200369917
- Publication date Nov 26, 2020
- Hitachi Chemical Company, Ltd.
- Yuya OTSUKA
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...
- Publication number 20200325360
- Publication date Oct 15, 2020
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20200299545
- Publication date Sep 24, 2020
- Hitachi Chemical Company, Ltd.
- Takaaki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD
- Publication number 20200032106
- Publication date Jan 30, 2020
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20180320024
- Publication date Nov 8, 2018
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD
- Publication number 20180258319
- Publication date Sep 13, 2018
- Hitachi Chemical Company, Ltd.
- Toshiaki AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, POLISHING FLUID SET, POLISHING FLUID, AND SUBSTRATE POLISHI...
- Publication number 20180251664
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...
- Publication number 20180251680
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...
- Publication number 20180108536
- Publication date Apr 19, 2018
- Hitachi Chemical Company, Ltd.
- Tomohiro Iwano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing Agent, Stock Solution for Polishing Agent, and Polishing...
- Publication number 20180043497
- Publication date Feb 15, 2018
- Hitachi Chemical Company, Ltd.
- Masayuki Hanano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE
- Publication number 20160319159
- Publication date Nov 3, 2016
- Hitachi Chemical Company, Ltd.
- Hisataka MINAMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY, POLISHING SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...
- Publication number 20160280961
- Publication date Sep 29, 2016
- Hitachi Chemical Company, Ltd.
- Tomohiro IWANO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Tomohiro Iwano

Person

Patents Grantslast 30 patents

Slurry and polishing method

Slurry, screening method, and polishing method

Polishing liquid, polishing liquid set, and polishing method

Polishing liquid, polishing liquid set, and polishing method

Polishing liquid, polishing liquid set, and polishing method

Slurry and polishing method

Polishing solution and polishing method

Slurry, polishing-liquid set, polishing liquid, and polishing metho...

Polishing liquid, polishing liquid set, and polishing method

Slurry and polishing method

Slurry, and polishing method

Slurry and polishing method

Slurry, polishing solution production method, and polishing method

Slurry, method for producing polishing liquid, and polishing method

Slurry, polishing solution production method, and polishing method

Polishing liquid, polishing liquid set and polishing method

Polishing liquid, polishing liquid set and polishing method

Polishing liquid, polishing liquid set, and polishing method

Polishing liquid, polishing liquid set, and substrate polishing method

Polishing agent, stock solution for polishing agent, and polishing...

Slurry, polishing liquid set, polishing liquid, method for polishin...

Abrasive, abrasive set, and method for polishing substrate

Slurry, polishing-liquid set, polishing liquid, method for polishin...

Slurry, polishing fluid set, polishing fluid, and substrate polishi...

Polishing agent, polishing agent set, and substrate polishing method

Slurry, polishing-solution set, polishing solution, substrate polis...

Slurry, polishing-solution set, polishing solution, substrate polis...

Abrasive, abrasive set, and method for abrading substrate

Polishing liquid for CMP, and polishing method

Slurry, polishing solution set, polishing solution, and substrate p...

Patents Applicationslast 30 patents

SLURRY, SCREENING METHOD, AND POLISHING METHOD

POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHIN...

POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHI...

SLURRY, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTO...

SLURRY, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR CO...

POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

SLURRY AND POLISHING METHOD

POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

SLURRY, AND POLISHING METHOD

SLURRY, SCREENING METHOD, AND POLISHING METHOD

SLURRY AND POLISHING METHOD

SLURRY AND POLISHING METHOD

SLURRY, POLISHING SOLUTION PRODUCTION METHOD, AND POLISHING METHOD

SLURRY, METHOD FOR PRODUCING POLISHING LIQUID, AND POLISHING METHOD

SLURRY AND POLISHING METHOD

SLURRY, SLURRY SET AND POLISHING METHOD

POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

POLISHING SOLUTION AND POLISHING METHOD

SLURRY, POLISHING-LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...

SLURRY AND POLISHING METHOD

POLISHING LIQUID, POLISHING LIQUID SET, AND POLISHING METHOD

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

POLISHING LIQUID, POLISHING LIQUID SET, AND SUBSTRATE POLISHING METHOD

SLURRY, POLISHING FLUID SET, POLISHING FLUID, AND SUBSTRATE POLISHI...

SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...

SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHIN...

Polishing Agent, Stock Solution for Polishing Agent, and Polishing...

ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE

SLURRY, POLISHING SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLIS...