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Tomohiro KAWAHARA
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Osaka, JP
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Patents Grants
last 30 patents
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Patent Grant
Electroless palladium plating solution
Patent number
11,946,144
Issue date
Apr 2, 2024
C. Uyemura & Co., Ltd.
Tsuyoshi Maeda
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
ELECTROLESS PALLADIUM PLATING SOLUTION
Publication number
20200318239
Publication date
Oct 8, 2020
C. Uyemura & Co., Ltd.
Tsuyoshi MAEDA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
ELECTROLYTIC TIN ALLOY PLATING SOLUTION
Publication number
20200123673
Publication date
Apr 23, 2020
C. Uyemura & Co., Ltd.
Daisuke HASHIMOTO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...