Tomohiro NAGOYA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Temporary protective film for semiconductor sealing molding, lead f...
- Patent number 11,908,762
- Issue date Feb 20, 2024
- Resonac Corporation
- Naoki Tomori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary protective film for semiconductor encapsulation molding,...
- Patent number 11,682,564
- Issue date Jun 20, 2023
- Resonac Corporation
- Takahiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary protective film for semiconductor encapsulation molding,...
- Patent number 11,251,055
- Issue date Feb 15, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takahiro Kuroda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Temporary protective film for semiconductor sealing molding
- Patent number 11,195,728
- Issue date Dec 7, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Naoki Tomori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20230174828
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTI...
- Publication number 20230178385
- Publication date Jun 8, 2023
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20220319873
- Publication date Oct 6, 2022
- Showa Denko Materials Co., Ltd.
- Tomohiro NAGOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY,...
- Publication number 20220285200
- Publication date Sep 8, 2022
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...
- Publication number 20220020606
- Publication date Jan 20, 2022
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE, REEL...
- Publication number 20210395577
- Publication date Dec 23, 2021
- Showa Denko Materials Co., Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING, LEAD F...
- Publication number 20210050274
- Publication date Feb 18, 2021
- Hitachi Chemical Company, Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, L...
- Publication number 20210020460
- Publication date Jan 21, 2021
- Hitachi Chemical Company, Ltd.
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING
- Publication number 20200118841
- Publication date Apr 16, 2020
- Hitachi Chemical Company, Ltd.
- Naoki TOMORI
- H01 - BASIC ELECTRIC ELEMENTS

Tomohiro NAGOYA

Person

Patents Grantslast 30 patents

Temporary protective film for semiconductor sealing molding, lead f...

Temporary protective film for semiconductor encapsulation molding,...

Temporary protective film for semiconductor encapsulation molding,...

Temporary protective film for semiconductor sealing molding

Patents Applicationslast 30 patents

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

TEMPORARY PROTECTION FILM FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTI...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY,...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING,...

TEMPORARY PROTECTIVE FILM FOR PRODUCING SEMICONDUCTOR DEVICE, REEL...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING, LEAD F...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATIONMOLDING, L...

TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR SEALING MOLDING