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Tomohiro Nakano

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  • Gotemba, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Socket for semiconductor package
    • Patent number 7,275,938
    • Issue date Oct 2, 2007
    • Molex Incorporated
    • Tomohiro Nakano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Insulation displacement connector
    • Patent number 7,156,688
    • Issue date Jan 2, 2007
    • Molex Incorporated
    • Tomohiro Nakano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    IC socket
    • Patent number 6,471,524
    • Issue date Oct 29, 2002
    • Molex Incorporated
    • Tomohiro Nakano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Test socket lattice
    • Patent number 6,283,780
    • Issue date Sep 4, 2001
    • Molex Incorporated
    • Isamu Yamamoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket for IC package
    • Patent number 6,276,949
    • Issue date Aug 21, 2001
    • Molex Incorporated
    • Tomohiro Nakano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Burn-in test socket
    • Patent number 6,267,603
    • Issue date Jul 31, 2001
    • Molex Incorporated
    • Isamu Yamamoto
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Socket apparatus
    • Patent number 5,690,281
    • Issue date Nov 25, 1997
    • Texas Instruments Incorporated
    • Kiyokazu Ikeya
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents