Tomohiro SENJU

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Kawasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package with strip line structure and high fre...
- Patent number 10,224,291
- Issue date Mar 5, 2019
- Kabushiki Kaisha Toshiba
- Osamu Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency semiconductor amplifier
- Patent number 9,887,676
- Issue date Feb 6, 2018
- Kabushiki Kaisha Toshiba
- Osamu Moriya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High frequency ceramic package and fabrication method for the same
- Patent number 8,476,755
- Issue date Jul 2, 2013
- Kabushiki Kaisha Toshiba
- Tomohiro Senju
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY SEMICONDUCTOR DEVICE AND PACKAGE THEREFOR
- Publication number 20170373017
- Publication date Dec 28, 2017
- KABUSHIKI KAISHA TOSHIBA
- Osamu MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY SEMICONDUCTOR AMPLIFIER
- Publication number 20170373652
- Publication date Dec 28, 2017
- KABUSHIKI KAISHA TOSHIBA
- Osamu MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND HIGH-FREQUENCY SEMICONDUCTOR DEVICE
- Publication number 20110186979
- Publication date Aug 4, 2011
- Kabushiki Kaisha Toshiba
- Tomohiro SENJU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY CERAMIC PACKAGE AND FABRICATION METHOD FOR THE SAME
- Publication number 20100019376
- Publication date Jan 28, 2010
- Kabushiki Kaisha Toshiba
- Tomohiro SENJU
- H01 - BASIC ELECTRIC ELEMENTS