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Tomohisa Kawai
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Kanuma-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Cutting method and cutting device for adhesive film
Patent number
8,206,544
Issue date
Jun 26, 2012
Sony Chemical & Information Device Corporation
Tomohisa Kawai
B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information
Patent Grant
Suction device and method of conveying laminated sheet
Patent number
7,367,560
Issue date
May 6, 2008
Sony Corporation
Tomohisa Kawai
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
Information
Patent Application
Cutting method and cutting device for adhesive film
Publication number
20070017331
Publication date
Jan 25, 2007
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Tomohisa Kawai
B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information
Patent Application
Sunction device and method of conveying laminated sheet
Publication number
20070013122
Publication date
Jan 18, 2007
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Tomohisa Kawai
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL