Tomoki HIRAI

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE
- Publication number 20240034833
- Publication date Feb 1, 2024
- Resonac Corporation
- Yuta SUKEGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY-INSULATING RESIN COMPOSITION AND ELECTRICAL INSULATOR
- Publication number 20220230778
- Publication date Jul 21, 2022
- Showa Denko Materials Co., Ltd.
- Tomoki HIRAI
- H01 - BASIC ELECTRIC ELEMENTS