Tomoki Kawasaki

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Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed semiconductor device, leadframe with die pads, and man...
- Patent number 7,952,177
- Issue date May 31, 2011
- Panasonic Corporation
- Tomoki Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE, LEADFRAME WITH DIE PADS, AND MAN...
- Publication number 20090008754
- Publication date Jan 8, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tomoki Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-sealed semiconductor device, leadframe with die pads, and man...
- Publication number 20060097371
- Publication date May 11, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Tomoki Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS