Tomoki MORIJIRI

Follow

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition and coupling structure
- Patent number 11,887,748
- Issue date Jan 30, 2024
- Tomoki Morijiri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION AND COUPLING STRUCTURE
- Publication number 20230146296
- Publication date May 11, 2023
- Showa Denko Materials Co., Ltd.
- Tomoki MORIJIRI
- H01 - BASIC ELECTRIC ELEMENTS