Tomoki Nishino

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for manufacturing a semiconductor device having a logic cir...
- Patent number 5,989,934
- Issue date Nov 23, 1999
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer
- Patent number 5,897,193
- Issue date Apr 27, 1999
- Sony Corporation
- Tomoki Nishino
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 5,510,654
- Issue date Apr 23, 1996
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite stacked semiconductor device with contact plates
- Patent number 5,343,075
- Issue date Aug 30, 1994
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inner lead arrangement with enhanced st...
- Patent number 5,331,201
- Issue date Jul 19, 1994
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit card
- Patent number 5,289,349
- Issue date Feb 22, 1994
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,233,130
- Issue date Aug 3, 1993
- Sony Corporation
- Tomoki Nishino
- H01 - BASIC ELECTRIC ELEMENTS