Tomoki Yoshino

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 10,610,974
- Issue date Apr 7, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 10,096,517
- Issue date Oct 9, 2018
- Disco Corporation
- Tomoki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer producing method
- Patent number 10,081,076
- Issue date Sep 25, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer processing method
- Patent number 9,997,392
- Issue date Jun 12, 2018
- Disco Corporation
- Tomoki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250079331
- Publication date Mar 6, 2025
- Disco Corporation
- Nobuki KAKIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20190009373
- Publication date Jan 10, 2019
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170250102
- Publication date Aug 31, 2017
- Disco Corporation
- Tomoki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170243786
- Publication date Aug 24, 2017
- Disco Corporation
- Tomoki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20160288251
- Publication date Oct 6, 2016
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR