Tomoko HATSUKADE

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
ADDITIVE FOR ELECTROPLATING SOLUTION, ELECTROPLATING SOLUTION, ELEC...
- Publication number 20240132453
- Publication date Apr 25, 2024
- ADEKA CORPORATION
- Takuya TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING SOLUTION, METHOD OF PRODUCING SAME, AND COPPE...
- Publication number 20230025950
- Publication date Jan 26, 2023
- ADEKA CORPORATION
- Takuya TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR ELECTROPLATING SOLUTIONS, ELECTROPLATING SOLUTION, ELE...
- Publication number 20220220065
- Publication date Jul 14, 2022
- ADEKA CORPORATION
- Takuya TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH...
- Publication number 20180135196
- Publication date May 17, 2018
- ADEKA CORPORATION
- Takuya TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH...
- Publication number 20160053394
- Publication date Feb 25, 2016
- ADEKA CORPORATION
- Takuya TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR