Tomoko Higashino

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,002,808
- Issue date Jun 19, 2018
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with modified regions for dividing the chip
- Patent number 9,070,560
- Issue date Jun 30, 2015
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,006,036
- Issue date Apr 14, 2015
- Renesas Electronics Corporation
- Tomoko Higashino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device manufacturing method using laser irradiation a...
- Patent number 8,772,135
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method comprising a metal patter...
- Patent number 8,084,334
- Issue date Dec 27, 2011
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method comprising a metal patter...
- Patent number 7,892,949
- Issue date Feb 22, 2011
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 7,563,642
- Issue date Jul 21, 2009
- Renesas Technology Corp.
- Tomoko Higashino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a manufacturing method of the same
- Patent number 7,514,294
- Issue date Apr 7, 2009
- Renesas Technology Corp.
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,148,081
- Issue date Dec 12, 2006
- Renesas Technology Corp.
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,916,686
- Issue date Jul 12, 2005
- Renesas Technology Corporation
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for manufacturing the same
- Patent number 6,750,080
- Issue date Jun 15, 2004
- Renesas Technology Corp.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 6,552,437
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating adhesive for electronic parts, and lead frame and semico...
- Patent number 6,445,076
- Issue date Sep 3, 2002
- Hitachi Chemical Company, Ltd.
- Takehiro Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20180277456
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20170092554
- Publication date Mar 30, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20150235973
- Publication date Aug 20, 2015
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki ABE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140252643
- Publication date Sep 11, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140080260
- Publication date Mar 20, 2014
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20130143359
- Publication date Jun 6, 2013
- RENESAS ELECTRONICS CORPORATION
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20120077332
- Publication date Mar 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING A METAL PATTER...
- Publication number 20110124180
- Publication date May 26, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20100213594
- Publication date Aug 26, 2010
- Renesas Technology Corp.
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20090191667
- Publication date Jul 30, 2009
- Renesas Technology Corp.
- Tomoko HIGASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR
- Publication number 20090121337
- Publication date May 14, 2009
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a semiconductor device
- Publication number 20070218651
- Publication date Sep 20, 2007
- RENESAS TECHNOLOGY CORP.
- Tomoko Higashino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070114672
- Publication date May 24, 2007
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a manufacturing method of the same
- Publication number 20070037321
- Publication date Feb 15, 2007
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20040241907
- Publication date Dec 2, 2004
- Tomoko Higashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20030153127
- Publication date Aug 14, 2003
- Hitachi, Ltd. Hitachi ULSI Systems Co., Ltd.
- Takashi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for manufacturing the same
- Publication number 20030122262
- Publication date Jul 3, 2003
- Hitachi, Ltd.
- Masachika Masuda
- H01 - BASIC ELECTRIC ELEMENTS

Tomoko Higashino

Person

Patents Grantslast 30 patents

Semiconductor device manufacturing method and semiconductor device

Semiconductor chip with modified regions for dividing the chip

Method of manufacturing semiconductor device

Semiconductor device manufacturing method using laser irradiation a...

Semiconductor device manufacturing method comprising a metal patter...

Semiconductor device manufacturing method comprising a metal patter...

Manufacturing method of a semiconductor device

Semiconductor device and a manufacturing method of the same

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device and process for manufacturing the same

Semiconductor device and method of manufacture thereof

Insulating adhesive for electronic parts, and lead frame and semico...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD COMPRISING A METAL PATTER...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR

Manufacturing method of a semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and a manufacturing method of the same

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device and process for manufacturing the same