Tomoko Noguchi

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Beppu City, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having tapered metal coated sidewalls
- Patent number 11,923,320
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Tomoko Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20240213178
- Publication date Jun 27, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
- Publication number 20220208689
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tomoko NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS WITH SEPARATED MAGNETIC MEMBERS
- Publication number 20220068556
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yi YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS