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Tomoko Wake

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CMP process for a damascene pattern
    • Publication number 20030211742
    • Publication date Nov 13, 2003
    • Akira Kubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of manufacturing semiconductor device
    • Publication number 20020187640
    • Publication date Dec 12, 2002
    • Tomoko Wake
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Slurry for chemical mechanical polishing
    • Publication number 20020104268
    • Publication date Aug 8, 2002
    • NEC Corporation
    • Yasuaki Tsuchiya
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Chemical mechanical polishing slurry
    • Publication number 20020095872
    • Publication date Jul 25, 2002
    • NEC Corporation
    • Yasuaki Tsuchiya
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Slurry for chemical mechanical polishing
    • Publication number 20020095874
    • Publication date Jul 25, 2002
    • NEC Corporation
    • Yasuaki Tsuchiya
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Chemical mechanical polishing slurry
    • Publication number 20020093002
    • Publication date Jul 18, 2002
    • NEC Corporation
    • Yasuaki Tsuchiya
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    CMP process for a damascene pattern
    • Publication number 20020048958
    • Publication date Apr 25, 2002
    • Akira Kubo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Process for forming a metal interconnect
    • Publication number 20020037642
    • Publication date Mar 28, 2002
    • Tomoko Wake
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Process for forming a metal interconnect
    • Publication number 20010006841
    • Publication date Jul 5, 2001
    • Yasuaki Tsuchiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Slurry for chemical mechanical polishing
    • Publication number 20010006225
    • Publication date Jul 5, 2001
    • Yasuaki Tsuchiya
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    Slurry for chemical mechanical polishing
    • Publication number 20010006224
    • Publication date Jul 5, 2001
    • Yasuaki Tsuchiya
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Slurry for chemical mechanical polishing
    • Publication number 20010005009
    • Publication date Jun 28, 2001
    • Yasuaki Tsuchiya
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...