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Tomoko YAMADA
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multilayer wiring board having lands with tapered side surfaces
Patent number
8,952,270
Issue date
Feb 10, 2015
Shinko Electric Industries, Co., Ltd.
Tomoko Yamada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring substrate and method of manufacturing the same
Patent number
8,618,424
Issue date
Dec 31, 2013
Shinko Electric Industries Co., Ltd.
Tomoko Yamada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing wiring substrate
Patent number
8,518,203
Issue date
Aug 27, 2013
Shinko Electric Industries Co., Ltd.
Tatsuya Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing wiring substrate
Patent number
8,394,225
Issue date
Mar 12, 2013
Shinko Electric Industries Co., Ltd.
Tatsuya Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
Publication number
20130146220
Publication date
Jun 13, 2013
Shinko Electric Industries Co., Ltd.
Tatsuya NAKAMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER WIRING BOARD
Publication number
20110155442
Publication date
Jun 30, 2011
Shinko Electric Industries Co., Ltd.
Tomoko YAMADA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Publication number
20110155439
Publication date
Jun 30, 2011
Shinko Electric Industries Co., Ltd.
Tomoko Yamada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
Publication number
20100096078
Publication date
Apr 22, 2010
Shinko Electric Industries Co., Ltd.
Tatsuya NAKAMURA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR