Tomomasa KASHINO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition for sealing semiconductor and semiconductor device
- Patent number 10,224,259
- Issue date Mar 5, 2019
- SUMITOMO BAKELITE CO., LTD.
- Yui Ozaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
- Publication number 20230095959
- Publication date Mar 30, 2023
- SUMITOMO BAKELITE CO., LTD.
- Tadasuke Endo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
- Publication number 20230018491
- Publication date Jan 19, 2023
- SUMITOMO BAKELITE CO., LTD.
- Tomomasa Kashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN SHEET, AND METAL BASE SUBSTRATE
- Publication number 20220372208
- Publication date Nov 24, 2022
- SUMITOMO BAKELITE CO., LTD.
- Tomomasa Kashino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
- Publication number 20160372394
- Publication date Dec 22, 2016
- SUMITOMO BAKELITE CO., LTD.
- Yui OZAKI
- H01 - BASIC ELECTRIC ELEMENTS