TREA

Tomonori HIRAO

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate holding apparatus
    • Patent number 11,658,058
    • Issue date May 23, 2023
    • Ebara Corporation
    • Takahiro Abe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating apparatus
    • Patent number 11,434,580
    • Issue date Sep 6, 2022
    • Ebara Corporation
    • Tomonori Hirao
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 11,339,496
    • Issue date May 24, 2022
    • Ebara Corporation
    • Tomonori Hirao
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 11,332,838
    • Issue date May 17, 2022
    • Ebara Corporation
    • Gaku Yamasaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 11,098,413
    • Issue date Aug 24, 2021
    • Ebara Corporation
    • Shao Hua Chang
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate holder and plating apparatus
    • Patent number 11,015,261
    • Issue date May 25, 2021
    • Ebara Corporation
    • Yoshitaka Mukaiyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 10,577,706
    • Issue date Mar 3, 2020
    • Ebara Corporation
    • Tomonori Hirao
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus
    • Patent number 10,294,576
    • Issue date May 21, 2019
    • Ebara Corporation
    • Tomonori Hirao
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 9,388,504
    • Issue date Jul 12, 2016
    • Ebara Corporation
    • Tomonori Hirao
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE HOLDING APPARATUS
    • Publication number 20210262109
    • Publication date Aug 26, 2021
    • EBARA CORPORATION
    • Takahiro Abe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    • Publication number 20210210368
    • Publication date Jul 8, 2021
    • EBARA CORPORATION
    • Toshio Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20200392641
    • Publication date Dec 17, 2020
    • EBARA CORPORATION
    • Tomonori Hirao
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20200277709
    • Publication date Sep 3, 2020
    • EBARA CORPORATION
    • Tomonori Hirao
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20190233964
    • Publication date Aug 1, 2019
    • EBARA CORPORATION
    • Tomonori HIRAO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20190112727
    • Publication date Apr 18, 2019
    • EBARA CORPORATION
    • Shao Hua CHANG
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20190093250
    • Publication date Mar 28, 2019
    • EBARA CORPORATION
    • Gaku YAMASAKI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE HOLDER AND PLATING APPARATUS
    • Publication number 20190084777
    • Publication date Mar 21, 2019
    • EBARA CORPORATION
    • Yoshitaka MUKAIYAMA
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    PLATING APPARATUS AND SUBSTRATE HOLDER USED TOGETHER WITH PLATING A...
    • Publication number 20180223444
    • Publication date Aug 9, 2018
    • EBARA CORPORATION
    • Toshio YOKOYAMA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS
    • Publication number 20160281254
    • Publication date Sep 29, 2016
    • EBARA CORPORATION
    • Tomonori HIRAO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING APPARATUS AND PLATING METHOD
    • Publication number 20140295093
    • Publication date Oct 2, 2014
    • Tomonori HIRAO
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR