Tomonori Nakamura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting apparatus
- Patent number 11,910,534
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Tomonori Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,545,462
- Issue date Jan 3, 2023
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PTFE sheet and method for mounting die
- Patent number 11,512,411
- Issue date Nov 29, 2022
- Shinkawa Ltd.
- Osamu Watanabe
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,508,689
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick-up device and pick-up method
- Patent number 11,508,599
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Yasuyuki Matsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,387,211
- Issue date Jul 12, 2022
- Shinkawa Ltd.
- Tetsuya Otani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip mounting device and method for manufacturing sem...
- Patent number 11,296,048
- Issue date Apr 5, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for setting conditions for heating semiconductor chip during...
- Patent number 11,201,132
- Issue date Dec 14, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,189,594
- Issue date Nov 30, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 11,172,600
- Issue date Nov 9, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting apparatus and method for manufacturing semiconductor device
- Patent number 11,094,567
- Issue date Aug 17, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding condition evaluation apparatus
- Patent number 11,069,650
- Issue date Jul 20, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting die
- Patent number 11,069,651
- Issue date Jul 20, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,024,596
- Issue date Jun 1, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
- Patent number 10,978,420
- Issue date Apr 13, 2021
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-device manufacturing method and manufacturing apparatus
- Patent number 10,937,758
- Issue date Mar 2, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and mounting device
- Patent number 10,896,901
- Issue date Jan 19, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and mounting apparatus
- Patent number 10,847,434
- Issue date Nov 24, 2020
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing apparatus which cooperate with other apparat...
- Patent number 10,277,544
- Issue date Apr 30, 2019
- Canon Kabushiki Kaisha
- Tomonori Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Information processing apparatus, method for controlling the same,...
- Patent number 9,195,381
- Issue date Nov 24, 2015
- Canon Kabushiki Kaisha
- Tomonori Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mobile communication network system and server apparatus
- Patent number 8,271,580
- Issue date Sep 18, 2012
- NTT DoCoMo, Inc.
- Sohei Tani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Schottky barrier diode and method for using the same
- Patent number 8,178,940
- Issue date May 15, 2012
- Central Research Institute Of Electric Power Industry
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide bipolar semiconductor device
- Patent number 8,154,026
- Issue date Apr 10, 2012
- Central Research Institute Of Electric Power Industry
- Ryosuke Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method therefor
- Patent number 7,960,257
- Issue date Jun 14, 2011
- The Kansai Electric Power Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method therefor
- Patent number 7,960,737
- Issue date Jun 14, 2011
- The Kansai Electric Power Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method therefor
- Patent number 7,960,738
- Issue date Jun 14, 2011
- The Kansai Electric Power Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky barrier semiconductor device and method for manufacturing...
- Patent number 7,902,054
- Issue date Mar 8, 2011
- Central Research Institute Of Electric Power Industry
- Hidekazu Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server for providing access by a communication terminal to a commun...
- Patent number 7,844,267
- Issue date Nov 30, 2010
- NTT DoCoMo, Inc.
- Hisanori Sawada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon carbide semiconductor device and manufacturing method therefor
- Patent number 7,768,017
- Issue date Aug 3, 2010
- The Kansai Electric Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
- Publication number 20240282017
- Publication date Aug 22, 2024
- Canon Kabushiki Kaisha
- TOMONORI NAKAMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ORGANIC ELECTROLUMINESCENCE DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20230209998
- Publication date Jun 29, 2023
- Idemitsu Kosan Co.,Ltd
- Ryota TAKAHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS AND METHOD FOR CORRECTING MOVEMENT AMOUNT OF BOND...
- Publication number 20220199448
- Publication date Jun 23, 2022
- SHINKAWA LTD.
- Makoto TAKAHASHI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220046838
- Publication date Feb 10, 2022
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEM...
- Publication number 20210257329
- Publication date Aug 19, 2021
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20210251112
- Publication date Aug 12, 2021
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETACHMENT DEVICE
- Publication number 20210197543
- Publication date Jul 1, 2021
- SHINKAWA LTD.
- Hiromi SHIBAHARA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210005570
- Publication date Jan 7, 2021
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-UP DEVICE AND PICK-UP METHOD
- Publication number 20200388521
- Publication date Dec 10, 2020
- SHINKAWA LTD.
- Yasuyuki MATSUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING DIE
- Publication number 20200321311
- Publication date Oct 8, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PTFE SHEET AND METHOD FOR MOUNTING DIE
- Publication number 20200291548
- Publication date Sep 17, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONDITION EVALUATION APPARATUS
- Publication number 20200286852
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
- Publication number 20200251441
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200243356
- Publication date Jul 30, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200243476
- Publication date Jul 30, 2020
- SHINKAWA LTD.
- Tetsuya OTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS AND MOUNTING SYSTEM
- Publication number 20200235070
- Publication date Jul 23, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200098721
- Publication date Mar 26, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20200006282
- Publication date Jan 2, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
- Publication number 20190312020
- Publication date Oct 10, 2019
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE
- Publication number 20190311964
- Publication date Oct 10, 2019
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS WHICH COOPERATE WITH OTHER APPARAT...
- Publication number 20160050173
- Publication date Feb 18, 2016
- Canon Kabushiki Kaisha
- Tomonori Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INFORMATION PROCESSING APPARATUS, METHOD FOR CONTROLLING THE SAME,...
- Publication number 20130271430
- Publication date Oct 17, 2013
- Canon Kabushiki Kaisha
- Tomonori Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOBILE COMMUNICATION NETWORK SYSTEM AND SERVER APPARATUS
- Publication number 20110119323
- Publication date May 19, 2011
- NTT DoCoMo, Inc.
- Sohei Tani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon carbide semiconductor device and manufacturing method therefor
- Publication number 20100258816
- Publication date Oct 14, 2010
- The Kansai Electric Power Co., Inc.
- Joji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device and manufacturing method therefor
- Publication number 20100258817
- Publication date Oct 14, 2010
- The Kansai Electric Power Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon carbide semiconductor device and manufacturing method therefor
- Publication number 20100261333
- Publication date Oct 14, 2010
- The Kansai Electric Power Co., Inc.
- Koji Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky Barrier Diode and Method for Using the Same
- Publication number 20090243026
- Publication date Oct 1, 2009
- Central Research Institute of Electric Power Industry
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky Barrier Semiconductor Device and Method for Manufacturing...
- Publication number 20090096053
- Publication date Apr 16, 2009
- Central Research Institute of Electric Power Industry
- Hidekazu Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS

Tomonori Nakamura

Person

Patents Grantslast 30 patents

Mounting apparatus

Method for producing structure, and structure

Mounting apparatus and mounting system

PTFE sheet and method for mounting die

Mounting apparatus and mounting system

Pick-up device and pick-up method

Bonding apparatus and bonding method

Semiconductor chip mounting device and method for manufacturing sem...

Method for setting conditions for heating semiconductor chip during...

Bonding apparatus and bonding method

Mounting device

Mounting apparatus and method for manufacturing semiconductor device

Bonding condition evaluation apparatus

Method of mounting die

Bonding apparatus and bonding method

Semiconductor chip mounting apparatus and semiconductor chip mounti...

Semiconductor-device manufacturing method and manufacturing apparatus

Method of manufacturing semiconductor device, and mounting device

Method of manufacturing semiconductor device, and mounting apparatus

Information processing apparatus which cooperate with other apparat...

Information processing apparatus, method for controlling the same,...

Mobile communication network system and server apparatus

Schottky barrier diode and method for using the same

Silicon carbide bipolar semiconductor device

Silicon carbide semiconductor device and manufacturing method therefor

Silicon carbide semiconductor device and manufacturing method therefor

Silicon carbide semiconductor device and manufacturing method therefor

Schottky barrier semiconductor device and method for manufacturing...

Server for providing access by a communication terminal to a commun...

Silicon carbide semiconductor device and manufacturing method therefor

Patents Applicationslast 30 patents

INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD

ORGANIC ELECTROLUMINESCENCE DEVICE, AND ELECTRONIC APPARATUS

BONDING APPARATUS AND METHOD FOR CORRECTING MOVEMENT AMOUNT OF BOND...

MOUNTING APPARATUS

SEMICONDUCTOR CHIP MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEM...

MOUNTING DEVICE

DETACHMENT DEVICE

BONDING APPARATUS AND BONDING METHOD

PICK-UP DEVICE AND PICK-UP METHOD

METHOD OF MOUNTING DIE

PTFE SHEET AND METHOD FOR MOUNTING DIE

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...

BONDING CONDITION EVALUATION APPARATUS

SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...

METHOD FOR MANUFACTURING MOUNTING DEVICE AND SEMICONDUCTOR DEVICE

BONDING APPARATUS AND BONDING METHOD

MOUNTING APPARATUS AND MOUNTING SYSTEM

BONDING APPARATUS AND BONDING METHOD

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE

SEMICONDUCTOR-DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE

INFORMATION PROCESSING APPARATUS WHICH COOPERATE WITH OTHER APPARAT...

INFORMATION PROCESSING APPARATUS, METHOD FOR CONTROLLING THE SAME,...

MOBILE COMMUNICATION NETWORK SYSTEM AND SERVER APPARATUS

Silicon carbide semiconductor device and manufacturing method therefor

Silicon carbide semiconductor device and manufacturing method therefor

Silicon carbide semiconductor device and manufacturing method therefor

Schottky Barrier Diode and Method for Using the Same

Schottky Barrier Semiconductor Device and Method for Manufacturing...