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Tomonori Shinoda
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Dicing sheet with protective film forming layer and chip fabricatio...
Patent number
9,786,541
Issue date
Oct 10, 2017
Lintec Corporation
Tomonori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing sheet with protective film forming layer and method for prod...
Patent number
9,754,811
Issue date
Sep 5, 2017
Lintec Corporation
Naoya Saeki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing sheet with protective film-forming layer, and method for pro...
Patent number
9,443,750
Issue date
Sep 13, 2016
Lintec Corporation
Tomonori Shinoda
B32 - LAYERED PRODUCTS
Information
Patent Grant
Resin film forming sheet for chip, and method for manufacturing sem...
Patent number
8,735,881
Issue date
May 27, 2014
Lintec Corporation
Tomonori Shinoda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Resin film forming sheet for chip, and method for manufacturing sem...
Patent number
8,674,349
Issue date
Mar 18, 2014
Lintec Corporation
Tomonori Shinoda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Semiconductor sealing resin sheet and semiconductor device manufact...
Patent number
8,034,667
Issue date
Oct 11, 2011
Lintec Corporation
Tomonori Shinoda
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Marking method and sheet for both protective film forming and dicing
Patent number
7,935,574
Issue date
May 3, 2011
Lintec Corporation
Naoya Saiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for producing resin-sealed type electronic device
Patent number
7,135,358
Issue date
Nov 14, 2006
Lintec Corporation
Takashi Sugino
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND METHOD FOR PROD...
Publication number
20150228526
Publication date
Aug 13, 2015
LINTEC CORPORATION
Naoya Saeki
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Dicing Sheet with Protective Film-Forming Layer, and Method for Pro...
Publication number
20150024576
Publication date
Jan 22, 2015
LINTEC CORPORATION
Tomonori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dicing Sheet with Protective Film Forming Layer and Chip Fabricatio...
Publication number
20140295646
Publication date
Oct 2, 2014
Tomonori Shinoda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
RESIN FILM FORMING SHEET FOR CHIP, AND METHOD FOR MANUFACTURING SEM...
Publication number
20140141570
Publication date
May 22, 2014
LINTEC CORPORATION
Tomonori Shinoda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Resin Film Forming Sheet for Chip, and Method for Manufacturing Sem...
Publication number
20130011998
Publication date
Jan 10, 2013
LINTEC CORPORATION
Tomonori Shinoda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...
Publication number
20100090323
Publication date
Apr 15, 2010
Lintec Corporation
Tomonori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...
Publication number
20100025837
Publication date
Feb 4, 2010
LINTEC CORPORATION
Tomonori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Sheet for Forming a Protective Film for Chips
Publication number
20090053518
Publication date
Feb 26, 2009
LINTEC CORPORATION
Naoya Saiki
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Semiconductor Sealing Resin Sheet and Semiconductor Device Manufact...
Publication number
20070254410
Publication date
Nov 1, 2007
Lintec Corporation
Tomonori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Marking method and sheet for both protective film forming and dicing
Publication number
20060102987
Publication date
May 18, 2006
LINTEC CORPORATION
Naoya Saiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for producing resin-sealed type electronic device
Publication number
20050074922
Publication date
Apr 7, 2005
LINTEC CORPORATION
Takashi Sugino
H01 - BASIC ELECTRIC ELEMENTS