Tomoo Iwade

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Nukata-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including semiconductor packages stacked on on...
- Patent number 8,537,551
- Issue date Sep 17, 2013
- Denso Corporation
- Shigeo Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin mold type semiconductor device
- Patent number 7,728,413
- Issue date Jun 1, 2010
- Denso Corporation
- Tomoo Iwade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20200211954
- Publication date Jul 2, 2020
- DENSO CORPORATION
- Tomoo IWADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR PACKAGES STACKED ON ON...
- Publication number 20120008282
- Publication date Jan 12, 2012
- DENSO CORPORATION
- Shigeo IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin mold type semiconductor device
- Publication number 20070052072
- Publication date Mar 8, 2007
- DENSO CORPORATION
- Tomoo Iwade
- H01 - BASIC ELECTRIC ELEMENTS