Tomoo Matsuzawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked semiconductor chips sealed with...
- Patent number 7,199,469
- Issue date Apr 3, 2007
- Renesas Technology Corp.
- Toru Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,015,127
- Issue date Mar 21, 2006
- Renesas Technology Corp.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of solid-state image sensing device
- Patent number 7,005,310
- Issue date Feb 28, 2006
- Renesas Technology Corporation
- Kenji Hanada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with alternate bonding wire arrangement
- Patent number 6,900,551
- Issue date May 31, 2005
- Renesas Technology Corp.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 6,897,570
- Issue date May 24, 2005
- Renesas Technology, Corporation
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked lead structure
- Patent number 5,252,854
- Issue date Oct 12, 1993
- Hitachi, Ltd.
- Junichi Arita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20070187823
- Publication date Aug 16, 2007
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having improved adhesion between bonding and b...
- Publication number 20060138679
- Publication date Jun 29, 2006
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of solid-state image sensing device
- Publication number 20060091487
- Publication date May 4, 2006
- RENESAS TECHNOLOGY CORPORATION
- Kenji Hanada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050121805
- Publication date Jun 9, 2005
- Renesas Technology Corp. Hitachi ULSI Systems Co., Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device to provide improved...
- Publication number 20050035449
- Publication date Feb 17, 2005
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050001314
- Publication date Jan 6, 2005
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of solid-state image sensing device
- Publication number 20040166763
- Publication date Aug 26, 2004
- Kenji Hanada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040142551
- Publication date Jul 22, 2004
- Hitachi, Ltd.
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20030230809
- Publication date Dec 18, 2003
- Hitachi, Ltd
- Takashi Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030218245
- Publication date Nov 27, 2003
- Hitachi, Ltd.
- Tomoo Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030168740
- Publication date Sep 11, 2003
- Yasuyuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020043717
- Publication date Apr 18, 2002
- Toru Ishida
- H01 - BASIC ELECTRIC ELEMENTS

Tomoo Matsuzawa

Person

Patents Grantslast 30 patents

Semiconductor device having improved adhesion between bonding and b...

Semiconductor device having stacked semiconductor chips sealed with...

Method of manufacturing a semiconductor device to provide improved...

Semiconductor device and a method of manufacturing the same

Manufacturing method of solid-state image sensing device

Semiconductor device with alternate bonding wire arrangement

Semiconductor device and method of manufacturing same

Semiconductor device having stacked lead structure

Patents Applicationslast 30 patents

Semiconductor device

Semiconductor device having improved adhesion between bonding and b...

Manufacturing method of solid-state image sensing device

Semiconductor device and a method of manufacturing the same

Method of manufacturing a semiconductor device to provide improved...

Semiconductor device

Manufacturing method of solid-state image sensing device

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of manufacturing same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device